Memory
for AI

SF Memo's proprietary Verilog IP and chip-design methodology are active today with leading U.S. frontier AI labs. That current traction is the foundation for a broader memory-system research program spanning package-aware simulation, controller and PHY integration, interposer and RDL design, and preparation for package test vehicles with thermal, signal-integrity, and power-integrity validation.

Ongoing research is preparing TSV-aware thermal-management architectures for future 32-die and 64-die HBM stacks. The goal is greater capacity and bandwidth without compromising thermals, yield, or reliability.

Packaging is part of the memory product, not a downstream assembly step. The plan is to turn simulation into lab data and qualification evidence, expand U.S. packaging capability, and pursue California manufacturing.